Nowadays, electronic components are developing towards miniaturization, and packaging is also gradually becoming cheaper. General electronic components are plastic packaging. However, the disadvantage of plastic packaging is that humid gas will enter the interior of the device through the bonding surface of the packaging material and components. On the one hand, it will cause internal circuit oxidation, corrosion, and short circuit. The humid gas entering the inside of the IC is thermally expanded to generate enough pressure to cause separation (delamination), wire bonding damage, chip damage, and internal cracks. More severe cracks will extend to the surface of the component, causing the component to swell and burst. According to statistics, more than a quarter of the global electronics industry and other industrial manufacturing industries produce defective and scrapped products caused by humid air every year.

Finished electronic components will also be exposed to moisture during storage. The humidity of the production and storage environment of electronic industry products should be below 40%. Some varieties of electronic components require lower humidity. Therefore, desiccant is essential in the packaging of electronic components. Montmorillonite desiccant is a good helper for electronic products to prevent moisture. Under low humidity environment, the moisture absorption rate is slightly higher than that of silica gel. Can better protect your electronic products. And the price is only half of the silica gel desiccant.